Browse Prior Art Database

Multilayer Metal Substrate Package

IP.com Disclosure Number: IPCOM000054629D
Original Publication Date: 1980-Mar-01
Included in the Prior Art Database: 2005-Feb-13

Publishing Venue

IBM

Related People

Authors:
Berndlmaier, E Siwy, MJ [+details]

Abstract

This package has enhanced cooling and reduced mismatch between thermal expansion coefficients for chips and substrates.