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Method for Preparing Very High Purity Silica for Use as a Filler

IP.com Disclosure Number: IPCOM000054771D
Original Publication Date: 1980-Apr-01
Included in the Prior Art Database: 2005-Feb-13

Publishing Venue

IBM

Related People

Authors:
Escott, BM Ward, WC [+details]

Abstract

In the manufacture of integrated circuit chips it is frequently necessary to apply a passivating layer to the top of the chip to assure electrical integrity. One form which this layer takes is a film of polyimide resin which is applied and cured.