Browse Prior Art Database

Low Profile Chip Carrier With Integral Cooling Means

IP.com Disclosure Number: IPCOM000054773D
Original Publication Date: 1980-Apr-01
Included in the Prior Art Database: 2005-Feb-13

Publishing Venue

IBM

Related People

Authors:
Ecker, ME Harris, MJ Olson, LT [+details]

Abstract

This article discloses a semiconductor die with a wiring skirt in which the semiconductor chip is mounted on a membrane-like insulating member which provides multilevel wiring and interconnections between the chip mounted thereon and a secondary structure such as a metallized ceramic substrate. Fig. 1 illustrates the basic fabrication and assembly sequence of the process.