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Method for Controlling Via Sidewall Slope

IP.com Disclosure Number: IPCOM000054789D
Original Publication Date: 1980-Apr-01
Included in the Prior Art Database: 2005-Feb-13

Publishing Venue

IBM

Related People

Authors:
Chang, K Chiu, GT Hoeg, AJ [+details]

Abstract

Current methods for etching via holes by reactive ion etching have several disadvantages. The most serious disadvantage is that the side wall of the via hole has a variable slope and the slope is not controllable. This results in providing via holes with differing sidewall slopes.