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Process for Reducing Water Permeability of Modified Polymide-Amide

IP.com Disclosure Number: IPCOM000054791D
Original Publication Date: 1980-Apr-01
Included in the Prior Art Database: 2005-Feb-13

Publishing Venue

IBM

Related People

Authors:
Agnihotri, RK [+details]

Abstract

AIP-10* polyimide-amide and other polyimides can be used for surface coatings in various semiconductor applications, i.e., device and package structures. Its inherent permeability can result in corrosion to underlying metallurgy structures.