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Etching Method for Producing Patterns in Nickel Iron Layers

IP.com Disclosure Number: IPCOM000054828D
Original Publication Date: 1980-Apr-01
Included in the Prior Art Database: 2005-Feb-13

Publishing Venue

IBM

Related People

Authors:
Boeckl, R Meyer, D Pressler, G [+details]

Abstract

A nickel-iron layer is deposited on an aluminum oxide ceramic substrate by sputtering and subsequent plating. For generating the desired pattern, the nickel-iron layer is etched through a positive resist mask. As an etchant, an ammonium persulfate solution acidified with sulfuric acid is used. The etching solution contains about 25 per cent by weight ammonium persulfate and 5 per cent by weight H(2)SO(4), the pH value of the solution being about 1 to 2. Generally, etching periods of about 2 minutes are used, although longer periods are equally suitable without disadvantages being encountered.