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Substrate Connector assembly for Thermal Printhead

IP.com Disclosure Number: IPCOM000054863D
Original Publication Date: 1980-Apr-01
Included in the Prior Art Database: 2005-Feb-13

Publishing Venue

IBM

Related People

Authors:
Perry, JR Regehr, JL Wheeler, CL [+details]

Abstract

This assembly provides a means for mounting a thermal printhead to a heat sink with accommodation for connection to contacts which energize the individual print elements.