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Lift-Off and Etching Technique

IP.com Disclosure Number: IPCOM000054876D
Original Publication Date: 1980-Apr-01
Included in the Prior Art Database: 2005-Feb-13

Publishing Venue

IBM

Related People

Authors:
Decker, SK Erez, N [+details]

Abstract

A method for forming patterns of thin insulating films uses the same photoresist mask to etch an insulating layer, such as alumina, and a second layer, such as titanium.