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Lift Off Process for Precisely Defined Geometry

IP.com Disclosure Number: IPCOM000054888D
Original Publication Date: 1980-Apr-01
Included in the Prior Art Database: 2005-Feb-13

Publishing Venue

IBM

Related People

Authors:
Broom, RF Forster, T Oosenbrug, A [+details]

Abstract

A lift-off process was previously disclosed [*] which provided a deposit of material on a substrate with clean edges that are free of fences or flags. The process provides for a resist pattern without undercut, for depositing an excess amount of metal or dielectric, and for etching back to remove scattered material from the resist walls.