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Contactless Field Assist Bonding

IP.com Disclosure Number: IPCOM000054923D
Original Publication Date: 1980-Apr-01
Included in the Prior Art Database: 2005-Feb-13

Publishing Venue

IBM

Related People

Authors:
Bajorek, CH Bogardus, EH DiStefano, TH Horstmann, RE [+details]

Abstract

A method of contactless bonding of small articles through high voltage electrical heating is described in the preceding article. In that article, a flame is passed across a high voltage electrode onto one of the articles to be bonded (with the other article grounded), causing the electrical current to pass through the flame, heating the interface between the articles as the current passes through, causing bonding of the articles. We have found that other sources of ions or electrons which can be maintained at a high potential can be used. Thus, in such field assisted bonding, the parts to be bonded are kept at a low temperature (200-300 deg. C) and the ion source (at high voltage) causes a current to flow through the insulating material. The result is that good bonds are made without physical contact to the cathode.