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Barrel Type Plasma Etching and Deposition System Disclosure Number: IPCOM000054925D
Original Publication Date: 1980-Apr-01
Included in the Prior Art Database: 2005-Feb-13

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Fowler, AB Lyons, VJ Rupprecht, HS [+details]


Non-uniform etching and deposition behavior has been frequently observed in batch-processed wafers, particularly when the wafers were arranged on a flat horizontal disc (radial dependence of etch rate). It is suggested here to mount the wafers on the surface of a barrel-like holder contained in a reaction tube similar to the situation encountered in barrel-type epi reactors.