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Low Cost Alpha Particle Shielding Process Disclosure Number: IPCOM000054971D
Original Publication Date: 1980-May-01
Included in the Prior Art Database: 2005-Feb-13

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Related People

Baron, HC Berger, RG Clark, RJ Farrar, PA Hildick, WK [+details]


In the packaging of silicon chips wherein the chips are mounted onto a ceramic substrate, it is important to insure a good bond between the ceramic and the chip. Also, as the circuitry on the chip becomes smaller and more closely packed, it is necessary to insure maximum shielding of the chip from alpha particle radiation. In so doing, it is necessary to insure that any bonding material be essentially free of alpha particle emitters as well as being a good shield against alpha particles emitted by the ceramic substrate.