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Magnetic Bubble Memory Package

IP.com Disclosure Number: IPCOM000054972D
Original Publication Date: 1980-May-01
Included in the Prior Art Database: 2005-Feb-13

Publishing Venue

IBM

Related People

Authors:
Beaulieu, PE Okoniewski, JS Schwenn, CW Slattery, WJ [+details]

Abstract

This article describes a new packaging arrangement for a magnetic bubble structure in which the substrate holder is a printed circuit board which is slotted so the the X and Y coil bobbins can be fitted over the chips mounted on the printed circuit. The unit is also provided with upper and lower magnet face plates and a base that provides pins to the exterior walls. A key feature of the package is the use of a molded pin carrier which eliminates many functional and fabrication constraints which plague other packages. With this molded pin carrier the substrate can be thin since it is not subject to pinning or coil winding stresses and smaller solenoid coils which require less driver power can be used.