Enhanced Substrate and Module Alpha Particle Barrier Process
Original Publication Date: 1980-May-01
Included in the Prior Art Database: 2005-Feb-13
An enhancement to a known alpha-particle barrier process is disclosed. Briefly, the known process calls for a uniform, void-free thickness of SYLGARDT or other alpha-particle barrier material to completely cover the volume defined by the upper active surface of the chip, bounded by the C-4 balls and the surface of the ceramic substrate. This barrier must be at least .002 inch or .05 mm thick. The known process is extremely sensitive, difficult to inspect, and inconsistent in achieving void-free barrier protection.