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High Density Josephson Board Technology Using Two Sided Etching

IP.com Disclosure Number: IPCOM000055112D
Original Publication Date: 1980-May-01
Included in the Prior Art Database: 2005-Feb-13

Publishing Venue

IBM

Related People

Authors:
Geldermans, P Palmer, MJ [+details]

Abstract

In packaging for Josephson device circuits, silicon boards used as holders of mercury (for electrical contact) are mounted transverse to a ground plane board, termed a foot. The silicon boards have been made by electro-discharge machining, which is difficult to use. In the present technique, two-sided etching of a silicon wafer having silicon oxide thereon is used to provide the boards.