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Stepped Flared-End Pinning

IP.com Disclosure Number: IPCOM000055196D
Original Publication Date: 1980-Jun-01
Included in the Prior Art Database: 2005-Feb-13

Publishing Venue

IBM

Related People

Authors:
Coombs, VD Healey, HJ [+details]

Abstract

Conventional pinning of metallized ceramic substrates involves upset forming of the pins after they are loaded into the substrate holes. On one side of the substrate, a head is formed on the pins, and on the opposite side, a bulge is formed to effectively lock the pins in the substrate. The upset regions of the pins exert a severe stress on the ceramic hole surface and substrate cracking may result.