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Wafer-Alignment System Via Stereo Split-Beam Optics Disclosure Number: IPCOM000055219D
Original Publication Date: 1980-Jun-01
Included in the Prior Art Database: 2005-Feb-13

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Motika, F [+details]


This method simplifies the alignment of wafers on any standard wafer handler used in line, product test, etc. The method utilizes, as shown in Figs. 1 and 2, the merging of target areas located at prefixed distances on the edges of wafers. This alignment system can be used to minimize manual chip alignment time and error, and to simplify automatic wafer-alignment systems.