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Individual Position Control for Multiple Devices used for Electroplating

IP.com Disclosure Number: IPCOM000055229D
Original Publication Date: 1980-Jun-01
Included in the Prior Art Database: 2005-Feb-13

Publishing Venue

IBM

Related People

Authors:
Berger, L Boeckl, R Kronemann, R Meyer, D [+details]

Abstract

When a number of substrates are simultaneously electroplated in an electroplating system, the distribution of the total current on the individual substrates frequently differs, particularly as a result of the respective effective resistance of the individual areas. This resistance depends upon the anode-cathode geometry, the bath agitation, the contacting resistance, and other influences. Spurious effects are also produced by the usual current concentration in the peripheral areas. Such effects lead to undesired differences in the thickness of the deposited layers and, if alloys are used, to differences in the composition of the alloys.