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Multilayer Polyimide Structures Disclosure Number: IPCOM000055279D
Original Publication Date: 1980-Jun-01
Included in the Prior Art Database: 2005-Feb-13

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Duran, J Missel, L Montelbano, TO [+details]


Many electronic devices require multilayer, laminated structures. We have found that polyimide may be used in such structures to bond to gold, tantalum, other metals and alloys, as well as to silicon, silicon dioxide, garnet and to polyimide itself.