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Multilayer Polyimide Structures

IP.com Disclosure Number: IPCOM000055279D
Original Publication Date: 1980-Jun-01
Included in the Prior Art Database: 2005-Feb-13

Publishing Venue

IBM

Related People

Authors:
Duran, J Missel, L Montelbano, TO [+details]

Abstract

Many electronic devices require multilayer, laminated structures. We have found that polyimide may be used in such structures to bond to gold, tantalum, other metals and alloys, as well as to silicon, silicon dioxide, garnet and to polyimide itself.