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Module Cap Ledge Corner Crimp Disclosure Number: IPCOM000055381D
Original Publication Date: 1980-Jul-01
Included in the Prior Art Database: 2005-Feb-13

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Saunders, AF [+details]


Integrated circuits are packed in modules which include a metallized ceramic substrate 10, a metal cap 12 and connecting pins 14. Integrated circuit chips are placed on the top surface of the metallized ceramic substrate, and circuit lines connect the chips to the pins 14. In order to automatically seal such a package, an epoxy sealing material is applied to the bottom surface of the metallized ceramic substrate 10 after capping. However, difficulties are encountered when the backsealing material runs in between the ceramic substrate 10 and the cap 12 because this backsealing material gets (a) under the chips causing it to lift off the substrate due to expansion or (b) on top of the metallized ceramic substrate disrupting the electrical connection between the chips and the circuit lines.