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Controlled Composition Gang Bond Chip Interconnection

IP.com Disclosure Number: IPCOM000055387D
Original Publication Date: 1980-Jul-01
Included in the Prior Art Database: 2005-Feb-13

Publishing Venue

IBM

Related People

Authors:
Ward, WC [+details]

Abstract

This article teaches an interconnection for gang bonding of semiconductor chips to preformed spiders which reduces or eliminates the electro-migration potential of gold-tin connected packages.