Browse Prior Art Database

Thermally Enhanced Self Leveling/Positive Contact Substrate Cap

IP.com Disclosure Number: IPCOM000055388D
Original Publication Date: 1980-Jul-01
Included in the Prior Art Database: 2005-Feb-13

Publishing Venue

IBM

Related People

Authors:
Buller, ML Phelps, D Ward, WC [+details]

Abstract

This article describes a technique for providing a self-leveling substrate contact cap for packaging integrated circuit chips.