Browse Prior Art Database

Repeatable, Reliable and Inexpensive Method of Flip-Flop Chip Bond Extension

IP.com Disclosure Number: IPCOM000055408D
Original Publication Date: 1980-Jul-01
Included in the Prior Art Database: 2005-Feb-13

Publishing Venue

IBM

Related People

Authors:
Bhattacharya, S Sullivan, EJ [+details]

Abstract

In joining semiconductor device chips to conductive bands on a dielectric (e.g., ceramic) substrate by the reflow of solder balls or pads, which provide both the electrical connection to the conductive bands and mechanical support for the chip (see, for example, U.S. Patent 3,436,818), thermal stress on these pad joints may be a problem. The problem is minimized by a controlled elongation of the solder joints.