Repeatable, Reliable and Inexpensive Method of Flip-Flop Chip Bond Extension
Original Publication Date: 1980-Jul-01
Included in the Prior Art Database: 2005-Feb-13
In joining semiconductor device chips to conductive bands on a dielectric (e.g., ceramic) substrate by the reflow of solder balls or pads, which provide both the electrical connection to the conductive bands and mechanical support for the chip (see, for example, U.S. Patent 3,436,818), thermal stress on these pad joints may be a problem. The problem is minimized by a controlled elongation of the solder joints.