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Edge Mounted Chip Assembly for Microprocessors

IP.com Disclosure Number: IPCOM000055412D
Original Publication Date: 1980-Jul-01
Included in the Prior Art Database: 2005-Feb-13

Publishing Venue

IBM

Related People

Authors:
Stoller, HI [+details]

Abstract

A low cost, high density chip assembly for microprocessor and memory applications is achieved by the edge bonding of "slave" chips to the major surface of a "master" chip. The "master" chip may be, for example, a microprocessor or a memory controller chip. The "slave" chips may be I/O chips or memory chips. Other combinations are also possible.