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Cooling Structure for an Integrated Circuit Module

IP.com Disclosure Number: IPCOM000055423D
Original Publication Date: 1980-Jul-01
Included in the Prior Art Database: 2005-Feb-13

Publishing Venue

IBM

Related People

Authors:
Amendola, A Peck, CA Prasad, C [+details]

Abstract

In semiconductor packages in which are mounted highly integrated semiconductor devices, heat must be removed from the devices to a suitable heat sink during operation. A suitable path must be provided for conducting the heat from the device to the cold plate. Temperature changes and differing coefficients of expansion of materials in the package present problems in providing an efficient low resistant path for the heat to be conducted from the device.