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Cooling Fin Structure Disclosure Number: IPCOM000055424D
Original Publication Date: 1980-Jul-01
Included in the Prior Art Database: 2005-Feb-13

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Horvath, JL [+details]


This cooling fin structure is effective, reliable, and relatively inexpensive. The structure is usable for both transverse and impingement cooling, particularly for high performance semiconductor packages in which are mounted a plurality of integrated circuit semiconductor devices.