Browse Prior Art Database

Cooling Fin Structure

IP.com Disclosure Number: IPCOM000055424D
Original Publication Date: 1980-Jul-01
Included in the Prior Art Database: 2005-Feb-13

Publishing Venue

IBM

Related People

Authors:
Horvath, JL [+details]

Abstract

This cooling fin structure is effective, reliable, and relatively inexpensive. The structure is usable for both transverse and impingement cooling, particularly for high performance semiconductor packages in which are mounted a plurality of integrated circuit semiconductor devices.