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Fluidized Thermal Interface

IP.com Disclosure Number: IPCOM000055469D
Original Publication Date: 1980-Jul-01
Included in the Prior Art Database: 2005-Feb-13

Publishing Venue

IBM

Related People

Authors:
Chu, RC Hwang, UP [+details]

Abstract

A Thermal interface is augmented with capillary flow of fluid. The flow of fluid ensures a substantial or total wetting of two contacting surfaces, thus improving the thermal contact resistance. Fluid has a higher thermal conductivity than ambient air. For example, water or water solutions are 20 times higher in conductivity than air and 4 times higher than helium gas. A preferred fluid consists essentially of a mixture of H(2)O, corrosion inhibitor or equivalent and other additives to control the wettability and capillary characteristics. In addition, it also possesses other properties, such as non-corrosive, antifreezing (to -40 degrees C), and safe handling.