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Minimal Metal Mask for Reactive Ion Etching Polyimide

IP.com Disclosure Number: IPCOM000055528D
Original Publication Date: 1980-Jul-01
Included in the Prior Art Database: 2005-Feb-13

Publishing Venue

IBM

Related People

Authors:
Cox, DE McGouey, RP [+details]

Abstract

The fabrication of thin film modules of multi-layered ceramic materials for packaging chips requires the making of via holes through a thermo-setting resin which serves as a dielectric between transmission line levels and transmission line-ground plane levels.