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Thermal Print Head Assembly Disclosure Number: IPCOM000055535D
Original Publication Date: 1980-Jul-01
Included in the Prior Art Database: 2005-Feb-13

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Matino, H [+details]


This development is an integrated silicon thermal print head structure which uses relatively conventional materials. It is formed on a glass layer which has been deposited on a silicon substrate. The silicon substrate incorporates a diode or transistor for sensing the increased heat accumulated which results from a thermal time constant that is longer than the electrical pulsed timing. By sensing this heat increase and thereby controlling a heating element associated with the print head, the accumulated heat is affected in a desired manner.