Browse Prior Art Database

Thermal Print Head Assembly

IP.com Disclosure Number: IPCOM000055535D
Original Publication Date: 1980-Jul-01
Included in the Prior Art Database: 2005-Feb-13

Publishing Venue

IBM

Related People

Authors:
Matino, H [+details]

Abstract

This development is an integrated silicon thermal print head structure which uses relatively conventional materials. It is formed on a glass layer which has been deposited on a silicon substrate. The silicon substrate incorporates a diode or transistor for sensing the increased heat accumulated which results from a thermal time constant that is longer than the electrical pulsed timing. By sensing this heat increase and thereby controlling a heating element associated with the print head, the accumulated heat is affected in a desired manner.