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Detection of Adhesion Failures

IP.com Disclosure Number: IPCOM000055573D
Original Publication Date: 1980-Aug-01
Included in the Prior Art Database: 2005-Feb-13

Publishing Venue

IBM

Related People

Authors:
Cochran, JL Dom, BE [+details]

Abstract

Adhesion failures between two materials may be detected by in temperature gradient across the outer material and employing a thermal scanner to detect, by the surface temperatures of the outer material, points of high thermal impedance, the high impedance evidencing the adhesion failures.