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Use of Ultrasonics for Integrated Circuit Chip Removal Disclosure Number: IPCOM000055597D
Original Publication Date: 1980-Aug-01
Included in the Prior Art Database: 2005-Feb-13

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Ameen, JG Funari, J Myers, FR [+details]


One technique for mounting integrated circuit chips on substrates is the utilization of small solder balls. The conventional technique for removing this type of chip from a substrate is to apply heat in order to melt or reflow the solder balls. Two problems with this technique of removing chips from substrates are that there is a limit on the number of times the solder balls can be reflowed, and, furthermore, if there are a plurality of chips on the substrates, the application of heat generally reflows the solder balls on all of the chip sites.