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Re Laminating External Copper Foils Disclosure Number: IPCOM000055598D
Original Publication Date: 1980-Aug-01
Included in the Prior Art Database: 2005-Feb-13

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Guiton, GA Matolka, W Summa, WJ [+details]


During the manufacture of complex multilayer printed circuit boards, the external layer of circuitry is sometimes misregistered relative to the internal layers. The misregistration of the external layer ruins the entire composite.