Browse Prior Art Database

Re Laminating External Copper Foils

IP.com Disclosure Number: IPCOM000055598D
Original Publication Date: 1980-Aug-01
Included in the Prior Art Database: 2005-Feb-13

Publishing Venue

IBM

Related People

Authors:
Guiton, GA Matolka, W Summa, WJ [+details]

Abstract

During the manufacture of complex multilayer printed circuit boards, the external layer of circuitry is sometimes misregistered relative to the internal layers. The misregistration of the external layer ruins the entire composite.