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Method of Making Ultra Fine Metal Powder

IP.com Disclosure Number: IPCOM000055605D
Original Publication Date: 1980-Aug-01
Included in the Prior Art Database: 2005-Feb-13

Publishing Venue

IBM

Related People

Authors:
Sullivan, MJ [+details]

Abstract

As the dimensions of microelectronic components become smaller and smaller, the difficulties involved in fabricating interconnections increase. The close terminal spacing and small diameter unimask sizes required for some soldered terminal applications make it very difficult to obtain a solder volume great enough to provide adequate terminal height, and, therefore, thermal cycling lifetimes of the device suffer. The solder volume can be substantially increased by screening solder paste on the substrate; however, extremely fine metal powder particle sizes are required. Also, as metal lines become smaller and closer, finer and finer molybdenum powder will be required.