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Heat Exchange Element for Semiconductor Device Cooling

IP.com Disclosure Number: IPCOM000055631D
Original Publication Date: 1980-Aug-01
Included in the Prior Art Database: 2005-Feb-13

Publishing Venue

IBM

Related People

Authors:
Edmonds, HD Markovits, G [+details]

Abstract

As the circuit density of integrated circuit semiconductor devices increases, the cooling of the devices becomes a major problem. Many techniques have been developed to cool the devices, for example, liquid cooling, conduction cooling, and the like. These techniques have disadvantages which make implementation difficult. For example, in liquid immersion cooling the liquid coolant presents contamination and corrosion problems. In conduction cooling the various interfaces necessary increase the thermal impedance.