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A high sensitivity resist layer structure which can also provide a metal lift-off process profile includes two layers of positive resist of the same type but having different photoactive compound levels.
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Lift-Off Structure Process
A high sensitivity resist layer structure which can also provide a metal lift-off
process profile includes two layers of positive resist of the same type but having
different photoactive compound levels.
A first layer of a resist including a phenol-formaldehyde novolak resin and a
naphthoquinone (1,2) diazide sulfonic acid ester sensitizer is coated onto the
substrate to a major part of the total desired dry film thickness and baked. A few
drops of resist solution containing a larger amount of photoactive compound are
then spun onto the first layer to give an additive layer of about 0.3 to 0.5 micron
and baked. The resist composite layer is then patternwise exposed to radiation
and developed. The surface induction property of the top layer and the high
development rate of the bottom layer provide an undercut metal lift-off process