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Lift-Off Structure Process

IP.com Disclosure Number: IPCOM000055634D
Original Publication Date: 1980-Aug-01
Included in the Prior Art Database: 2005-Feb-13

Publishing Venue

IBM

Related People

Authors:
Jeter, BA Narasimham, MA [+details]

Abstract

A high sensitivity resist layer structure which can also provide a metal lift-off process profile includes two layers of positive resist of the same type but having different photoactive compound levels.