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Force Free Solid Thermal Conduction Module Disclosure Number: IPCOM000055670D
Original Publication Date: 1980-Aug-01
Included in the Prior Art Database: 2005-Feb-13

Publishing Venue


Related People

Chu, RC Dessauer, RG Hwang, UP [+details]


The thermal interface between the piston and module hat is eliminated, thereby considerably improving the thermal conduction. Force transmission from the piston to the chip is also eliminated, preventing vibration/shock damage to chips and solder ball mounting connections.