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Force Free Solid Thermal Conduction Module

IP.com Disclosure Number: IPCOM000055670D
Original Publication Date: 1980-Aug-01
Included in the Prior Art Database: 2005-Feb-13

Publishing Venue

IBM

Related People

Authors:
Chu, RC Dessauer, RG Hwang, UP [+details]

Abstract

The thermal interface between the piston and module hat is eliminated, thereby considerably improving the thermal conduction. Force transmission from the piston to the chip is also eliminated, preventing vibration/shock damage to chips and solder ball mounting connections.