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The machining of parts in the 10-micrometer range, such as optical windows of silicon, and the removal of substrates are facilitated by providing a micrometer tool setting and an oscillating table.
English (United States)
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The machining of parts in the 10-micrometer range, such as optical windows
of silicon, and the removal of substrates are facilitated by providing a micrometer
tool setting and an oscillating table.
The machine is illustrated in the figure.
This machine mills flat-bottomed, circular holes or windows using diamond
paste as an abrasive.
The oscillating table is fitted to the outside of a needle bearing, the inside of
which is fitted on the shaft of the motor with an eccentricity of 1.5 mm. Rotation
of the table is prevented by a set of springs. The sample, mounted at the center
of the table, follows a circle of radius 1.5 mm at a frequency of 15 Hz. This
eccentricity is adequate to mill windows with diameters of 3-7 mm. The tool
holder is a sleeve bearing mounted in a slotted block. Screws are used to adjust
the parallelism of the bearing axis and motor axis. A horizontal x-y mechanism is
used to position the tool holder above the sample.
The tools are steel rods inserted in the tool holder. The depth of the hole
being milled is monitored with a micrometer. The final polishing is accomplished
with tools provided with felt pads. A lamp, mounted under a flat glass disk at the
center of the table, is useful for the monitoring and machining of thin windows.
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