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Multi Site Substrate Fluxing Mechanism Disclosure Number: IPCOM000055750D
Original Publication Date: 1980-Sep-01
Included in the Prior Art Database: 2005-Feb-13

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Related People

Cummings, AW Geany, GM Zaccaria, BA [+details]


This mechanism is useful in the manufacture of integrated circuit modules having a plurality of integrated circuit chips mounted on a single substrate. This mechanism enables a film of soldering flux to be simultaneously deposited at two or more different chip site locations on the substrate.