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This is a spray unit which allows spray batch rinsing of wafers with the wafers being rotated during the rinsing action so that a more uniform rinsing of the wafer occurs.
English (United States)
This text was extracted from a PDF file.
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This is the abbreviated version, containing approximately
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This is a spray unit which allows spray batch rinsing of wafers with the
wafers being rotated during the rinsing action so that a more uniform rinsing of
the wafer occurs.
The unit shown in section in the figure comprises an outer casing containing
a spray head 11 having an inlet port 12 coupled to a rinse fluid supply (not
shown) and having a multiplicity of spray nozzles (not shown) affixed to its
underside. Located directly below the spray head, but spaced apart from it, is a
rotator 13 which has a gang of rotating elements 14 driven by a motor 15. The
rotator is spaced far enough from the spray head 11 to assure sufficient room for
the location of a wafer carrier 16 between the head and the rotator which is
provided with an open bottom so that each wafer of a plurality of wafers 17
carried in the wafer holder 16 will be located directly over a respective one of the
rotating elements 14.
The unit operates as follows: A carrier 16, carrying the wafers 17, is placed in
the unit so that each of the wafers 17 is located over respective rotating element 14. The hinged cover 18 is then lowered over the unit 10 so as to form a
complete enclosure around the wafers to be cleaned. The rotator motor 15 is
started up, and the rinse fluid is introduced through the inlet port 12 into the spray
head 11 so that rinse fluid covers the now rotating wafers 17. This rinse fluid is
carried out through an outlet port 19 located in the bottom of the unit 10.