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Multilevel metal wiring patterns which are connected by metal studs are formed by the following process.
English (United States)
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Integral Stud for Multilevel Metal
Multilevel metal wiring patterns which are connected by metal studs are
formed by the following process.
A layer of wiring metal, an etch barrier layer of chromium and a layer of stud
metal are blanket deposited on a substrate in an evaporation or sputtering
system in a single pumpdown. The stud metal is patterned by reactive ion
etching using either a resist or a magnesium oxide mask, with the chromium
acting as an etch stop. The chromium and wiring metal are then patterned and
etched, and any MgO is stripped. A layer of insulator is deposited and the
structure is planarized using a thick organic layer. The organic layer and
insulator are etched back to expose the stud. The sequence is repeated for the
next level of metal wiring.