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Self-Aligning Heat Transfer Pad for Pad Mounted Chips

IP.com Disclosure Number: IPCOM000055790D
Original Publication Date: 1980-Sep-01
Included in the Prior Art Database: 2005-Feb-13

Publishing Venue

IBM

Related People

Authors:
Durand, R Mansuria, M Oktay, S Ostergren, CD [+details]

Abstract

This heat transfer pad assures annular thermal contact at all times, that is, for all chip tilt and height variations. The pad also improves thermal conductivity between the chip and the pad because of the improved alignment.