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Improved Wet Etch Self Aligned Process

IP.com Disclosure Number: IPCOM000055791D
Original Publication Date: 1980-Sep-01
Included in the Prior Art Database: 2005-Feb-13

Publishing Venue

IBM

Related People

Authors:
Lane, JG Ma, WH [+details]

Abstract

A process to obtain well-controlled, vertical walled profiles is described as follows: