Device Isolation by using a Narrow SiO(2) Trench
Original Publication Date: 1980-Sep-01
Included in the Prior Art Database: 2005-Feb-13
The tolerance of the device dimension achievable from the conventional process is controlled by lithographic methods. High resolution E-beam lithography is the most promising method for delineating a sub-micrometer size dimension. However, even with its high resolution capability, the tolerance that can be achieved by E-beam lithography is still larger than a few tenths of a micrometer.