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Ion milling is used for the cleaning of via holes between metallization levels atop semiconductor substrates.
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Ion Milling of Via Holes
Ion milling is used for the cleaning of via holes between metallization levels
atop semiconductor substrates.
Ion milling is a process in which surface material is worn away by high energy
ion bombardment. The binding energy (10 eV) is exceeded by ion
bombardment, and atoms are ejected from the surface.
An advantage of via ion mill cleaning in comparison with RF sputter cleaning
is that ion milling is extremely rapid. The temperature of the wafer can be
maintained very low while achieving a relatively high rate of removal. Since the
wafer is etched in a field and plasma-free environment, there are no restrictions
to shape, size and material. Wafers can be moved (rotated at 6 RPM) and tilted
during milling, thereby changing ion incident angles and etch rates.
One ion milling system which may be used is the Commonwealth Scientific
Corporation's Millatron II, which consists of a power supply cabinet and metering
panel plus a 2" ion gun.