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Ion Milling of Via Holes

IP.com Disclosure Number: IPCOM000055794D
Original Publication Date: 1980-Sep-01
Included in the Prior Art Database: 2005-Feb-13

Publishing Venue

IBM

Related People

Authors:
Frank, RA Petvai, SI Schnitzel, RH [+details]

Abstract

Ion milling is used for the cleaning of via holes between metallization levels atop semiconductor substrates.