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Low TCR Polysilicon Thin Film Standard

IP.com Disclosure Number: IPCOM000055803D
Original Publication Date: 1980-Sep-01
Included in the Prior Art Database: 2005-Feb-13

Publishing Venue

IBM

Related People

Authors:
Lloyd, JR Mackenzie, IG Polcari, MR [+details]

Abstract

It is often desirable to obtain a material with a low temperature coefficient of resistance (TCR) for use as a reference standard resistor in a changing thermal environment. In fact, a special class of metal alloys (i.e.. constant) has been developed for this purpose. Since the performance of these alloys is sensitive to the state of the metal (i.e. the stress state, purity, etc.) they are difficult to fabricate in thin film form.