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Method of Forming Convex Wafers

IP.com Disclosure Number: IPCOM000055822D
Original Publication Date: 1980-Sep-01
Included in the Prior Art Database: 2005-Feb-13

Publishing Venue

IBM

Related People

Authors:
Leroy, B Plougonven, C Thieulot, B [+details]

Abstract

It has been noticed that when wafers become badly warped (i.e., warpage >/- 20 mu) under certain circumstances, e.g., following a series of thermal treatments, the semiconductor wafers are either concave or convex (with respect to the active face), with no way of predicting the character of the resulting warpage.