Browse Prior Art Database

Electroplating Device

IP.com Disclosure Number: IPCOM000055828D
Original Publication Date: 1980-Sep-01
Included in the Prior Art Database: 2005-Feb-13

Publishing Venue

IBM

Related People

Authors:
Wetz, H [+details]

Abstract

This device ensures that several workpieces are effectively, simultaneously and uniformly plated in accordance with the electrodeposition method. It is particularly suitable for producing thin films on a plurality of workpieces, with the tolerances in the layer thicknesses to be applied being very small.