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Electroplating Device Disclosure Number: IPCOM000055828D
Original Publication Date: 1980-Sep-01
Included in the Prior Art Database: 2005-Feb-13

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Wetz, H [+details]


This device ensures that several workpieces are effectively, simultaneously and uniformly plated in accordance with the electrodeposition method. It is particularly suitable for producing thin films on a plurality of workpieces, with the tolerances in the layer thicknesses to be applied being very small.