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Chuck Cover Plate Disclosure Number: IPCOM000055830D
Original Publication Date: 1980-Sep-01
Included in the Prior Art Database: 2005-Feb-13

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Dreckman, U Heuber, K Malin, K [+details]


Cover plate 4 of semiconductive material is arranged between metallic base plate 2 of vacuum chuck 1 and workpiece 3. As shown in section A cover plate 4 is provided with corresponding vacuum bores 5, and its surface is covered with a thin oxide layer 6. Oxide layer 6 acts as an electrical insulation between base plate 2 and workpiece 3, without reducing the thermal conductance of the semiconductive material of cover plate 4.