Browse Prior Art Database

Shadow Techniques for X-Ray Lithographic Masks

IP.com Disclosure Number: IPCOM000055918D
Original Publication Date: 1980-Sep-01
Included in the Prior Art Database: 2005-Feb-13

Publishing Venue

IBM

Related People

Authors:
Hofer, DC Theis, TN [+details]

Abstract

Fine line X-ray lithographic masks may be fabricated using the vertical sidewalls or a relief structure that is created in an X-ray resist layer which has been spun cast onto a suitable polyimide membrane. The technique is described with relation to Figs. 1 and 2. Fig. 1: Isolated very narrow line. Step 1. Start with polyimide substrate coated with a layer of X-ray resist. Step 2. Vertical step in resist is produced by X-ray lithography. The mask may be fabricated using optical or E-beam techniques. Step 3. Vertically vapor deposit X-ray absorber (tungsten). Step 4. Stepped surface of Step 3 becomes X-ray mask. A suitably prepared substrate is exposed to obliquely incident X-rays. Step 5. Exposed and developed resist pattern.