Browse Prior Art Database

Heat Distributing, Stress Relieving Layer in Bubble Devices

IP.com Disclosure Number: IPCOM000055926D
Original Publication Date: 1980-Sep-01
Included in the Prior Art Database: 2005-Feb-13

Publishing Venue

IBM

Related People

Authors:
Gangulee, A [+details]

Abstract

A layer of aluminum may be inserted between the metallization layer and the garnet layer in bubble devices to reduce mechanical stress.