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A layer of aluminum may be inserted between the metallization layer and the garnet layer in bubble devices to reduce mechanical stress.
English (United States)
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Heat Distributing, Stress Relieving Layer in Bubble Devices
A layer of aluminum may be inserted between the metallization layer and the
garnet layer in bubble devices to reduce mechanical stress.
Conductors in contiguous disk bubble devices must carry large currents for
short time intervals. This causes undesirable temperature gradients in the
underlying magnetic garnet film, which produces mechanical stress. There are
also localized stresses in the adhesion layers for the conductors which cause
undesirable stresses in the underlying garnet film.
Fig. 1 illustrates a conventional contiguous disk bubble device structure. An
SiO(2) layer 10 on top of a magnetic garnet film 12 carries a nickel-iron sensor
1C. Another SiO(2) layer 16 spaces the sensor 14 from a gold conductor 18
which adheres to layer 16 via adhesion layer 20.
Fig. 2 is a similar structure except that the SiO(2) layer 10 has been replaced
by a first SiO(2) layer 22, a middle layer 24 of aluminum and a second SiO(2)
layer 26. Aluminum is preferred because of its high thermal conductivity and low
mechanical strength, but any other metal could be used instead. The aluminum
layer spreads out joule heat, thereby eliminating temperature gradients in the
garnet film. In addition, relatively low levels of mechanical stress can be
sustained by the aluminum layer, thus transferring only very low stress gradients
to the garnet film.
The aluminum layer can also act as a reflection layer, if visual observation of...